Piezoelectric driving device, robot, and driving method of the same

ABSTRACT

A piezoelectric driving device includes a vibrating plate, and a piezoelectric vibrating body including a substrate, and piezoelectric elements provided on the substrate. The piezoelectric element includes a first electrode, a second electrode, and a piezoelectric body, and the first electrode, the piezoelectric body, and the second electrode are laminated in this order on the substrate. The piezoelectric vibrating body is installed on the vibrating plate so that the piezoelectric element is interposed between the substrate and the vibrating plate. A wiring pattern including a first wiring corresponding to the first electrode and a second wiring corresponding to the second electrode is formed on the vibrating plate, the first electrode and the first wiring are connected to each other through a first laminated conducting portion, and the second electrode and the second wiring are connected to each other through a second laminated conducting portion.

BACKGROUND

1. Technical Field

The present invention relates to a piezoelectric driving device, andvarious apparatuses such as a robot including a piezoelectric drivingdevice.

2. Related Art

In the related art, a piezoelectric actuator (piezoelectric drivingdevice) using a piezoelectric element has been known (for example, seeJP-A-2004-320979). A basic configuration of this piezoelectric drivingdevice is a configuration in which four piezoelectric elements arearranged on each of two surfaces of a reinforcing plate to have two rowsand two columns, and accordingly, eight piezoelectric elements in totalare provided on both sides of the reinforcing plate. Each piezoelectricelement is a unit in which a piezoelectric body is interposed betweentwo electrodes and the reinforcing plate is also used as one electrodeof the piezoelectric element. A protrusion which comes in contact with arotor, which is a body to be driven, to rotate the rotor is provided onone end of the reinforcing plate. When the AC voltage is applied to twopiezoelectric elements diagonally disposed among the four piezoelectricelements, the two piezoelectric elements perform an expansion andcontraction operation, and accordingly, the protrusion of thereinforcing plate performs a reciprocal operation or an ellipticoperation. The rotor, which is a body to be driven, rotates in apredetermined rotation direction according to the reciprocal operationor the elliptic operation of the protrusion of the reinforcing plate. Inaddition, it is possible to rotate the rotor in a reverse direction, byswitching the two piezoelectric elements to be targets of application ofthe AC voltage, with the other two piezoelectric elements.

In the related art, a so-called bulk-like piezoelectric body has beenused as a piezoelectric body used in the piezoelectric driving device.In this specification, the “bulk-like piezoelectric body” means apiezoelectric body having a thickness equal to or greater than 100 μm. Areason for using the bulk-like piezoelectric body is because it isdesired to increase the thickness of the piezoelectric body, in order tosufficiently increase an amount of force applied to a body to be drivenfrom the piezoelectric driving device.

However, when the piezoelectric driving device is accommodated and usedin a small space (for example, in a joint of a robot), wiring space maybe insufficient in a case of the piezoelectric driving device using apiezoelectric body of the related art, and accordingly, the thickness ofthe piezoelectric body is desired to be smaller than 100 μm. However, inthe related art, a structure of a piezoelectric driving device suitablefor a piezoelectric body having a small thickness has not beensufficiently investigated.

In addition, in the related art, wiring between a driving circuit andthe piezoelectric element was constructed by soldering of a lead wire tothe electrodes of the piezoelectric element (see JP-A-2004-320979 andJP-A-8-111991). Accordingly, it is necessary to ensure a space for thelead wire and disconnection may easily occur during a wiring operation.

SUMMARY

An advantage of some aspects of the invention is to solve at least apart of the problems described above, and the invention can beimplemented as the following forms or application examples.

(1) An aspect of the invention provides a piezoelectric driving deviceincluding a vibrating plate and a piezoelectric vibrating body. Apiezoelectric vibrating body includes a substrate, a piezoelectric bodywhich is provided between the substrate and the vibrating plate, a firstelectrode which is provided between the piezoelectric body and thesubstrate, and a second electrode which is provided between thepiezoelectric body and the vibrating plate. A wiring patternelectrically connected to at least one of the first electrode and thesecond electrode is formed on the vibrating plate.

According to the piezoelectric driving device, since the wiring patternformed on the vibrating plate is electrically connected to at least oneof the first electrode and the second electrode, it is possible to savespace for the wirings and to decrease a possibility of disconnection,compared to a case where the first electrode and the second electrodeare connected to the driving circuit using a lead wire or soldering.

(2) In the piezoelectric driving device according to aspect describedabove, the wiring pattern may include a first wiring which iselectrically connected to the first electrode and a second wiring whichis electrically connected to the second electrode.

With this configuration, since the first wiring and the second wiring ofthe wiring pattern of the vibrating plate are connected to the firstelectrode and the second electrode, it is possible to save space for thewirings and to decrease a possibility of disconnection.

(3) In the piezoelectric driving device according to aspect describedabove, the first electrode and the first wiring may be electricallyconnected to each other through a first laminated conducting portion,and the second electrode and the second wiring may be electricallyconnected to each other through a second laminated conducting portion.

With this configuration, since the first wiring and the second wiring ofthe wiring pattern of the vibrating plate are connected to the firstelectrode and the second electrode through the first laminatedconducting portion and the second laminated conducting portion, it ispossible to save space for the wirings and to decrease a possibility ofdisconnection, compared to a case of using a lead wire or soldering.

(4) The piezoelectric driving device according to aspect described abovemay further include a conducting pattern of at least one layer which isprovided between the first electrode and the wiring pattern, and thefirst laminated conducting portion and the second laminated conductingportion may be formed on the conducting pattern of each layer.

With this configuration, it is possible to easily connect the firstelectrode and the second electrode of the piezoelectric element to thewiring pattern of the vibrating plate through the conducting pattern ofone or more layers.

(5) In the piezoelectric driving device according to aspect describedabove, the conducting pattern at a position farthest from the substratein a lamination direction among the conducting pattern of at least onelayer, may be electrically connected to the wiring pattern of thevibrating plate so that the surfaces come in contact with each other.

With this configuration, since the conducting pattern at a positionfarthest from the substrate is electrically connected to the wiringpattern of the vibrating plate so that the surfaces come in contact witheach other, it is possible to reliably and easily connect both patterns.

(6) In the piezoelectric driving device according to aspect describedabove, an insulating layer may be provided between the conductingpattern at a position closest to the second electrode in a laminationdirection among the conducting pattern of at least one layer, and thesecond electrode, and the conducting pattern at a position closest tothe second electrode and the second electrode may be electricallyconnected to each other through a plurality of contact holes provided onthe insulating layer.

With this configuration, since the conducting pattern and the secondelectrode are connected to each other through the plurality of contactholes, it is possible to decrease sheet resistance (parasiticresistance) between both the conducting pattern and the secondelectrode.

(7) In the piezoelectric driving device according to aspect describedabove, the conducting pattern of at least one layer may include a firstconducting pattern, a second conducting pattern, and an insulating layerwhich is provided between the first conducting pattern and the secondconducting pattern, the first laminated conducting portion in the firstconducting pattern and the first laminated conducting portion in thesecond conducting pattern may be electrically connected to each otherthrough a plurality of contact holes provided on the insulating layer,and the second laminated conducting portion in the first conductingpattern and the second laminated conducting portion in the secondconducting pattern may be electrically connected to each other through aplurality of contact holes provided on the insulating layer.

With this configuration, since the conducting patterns are electricallyconnected to each other through the plurality of contact holes, it ispossible to decrease sheet resistance (parasitic resistance) betweenboth the conducting patterns.

(8) In the piezoelectric driving device according to aspect describedabove, the vibrating plate may include a surface portion on which thepiezoelectric vibrating body is not loaded, and the wiring pattern maybe formed to be extended to a surface portion on which the piezoelectricvibrating body is not loaded.

With this configuration, it is possible to easily perform connectionbetween the electrode of the piezoelectric element and the drivingcircuit.

(9) In the piezoelectric driving device according to aspect describedabove, the piezoelectric body may have a thickness of 0.05 μm to 20 μm.

With this configuration, since the conducting patterns are connected toeach other through the plurality of contact holes and the sheetresistance (parasitic resistance) is decreased, it is possible todecrease a loss and increase efficiency, even when a piezoelectric bodyof a thin film having a thickness of 0.05 μm to 20 μm is used and avoltage applied to the piezoelectric body is increased.

(10) In the piezoelectric driving device according to above aspect, thevibrating plate may be formed with a conductive member, and a part ofthe wiring pattern may be formed over the side surface of the vibratingplate and may be electrically connected to the vibrating plate.

With this configuration, it is possible to easily connect the electrodeof the piezoelectric element and the vibrating plate.

(11) In the piezoelectric driving device according to aspect describedabove, the piezoelectric vibrating body may include a plurality ofpiezoelectric elements configured with the first electrode, thepiezoelectric body, and the second electrode, the plurality ofpiezoelectric elements may be divided into N sets (N is integer equal toor larger than 2) of piezoelectric element groups, when one or morepiezoelectric elements driven at the same time are set as one set ofpiezoelectric element group, the second electrodes of two or morepiezoelectric elements may be directly connected to each other through aconnection wiring, when each set of the piezoelectric element groupincludes two or more piezoelectric elements, and N second wirings and Nsecond laminated conducting portions may be provided to be insulatedfrom each other, to correspond to each second electrode of the N sets ofpiezoelectric element groups.

With this configuration, it is possible to easily connect the secondelectrode of the N sets of piezoelectric element groups to N secondwirings of the vibrating plate using N second laminated conductingportions.

(12) In the piezoelectric driving device according to aspect describedabove, a protrusion which may be provided on the vibrating plate and maycome in contact with a body to be driven.

With this configuration, it is possible to cause a body to be driven tomove using the protrusion.

The invention can be implemented in various forms, and, for example, canbe implemented in various embodiments of various apparatuses, a drivingmethod thereof such as a driving method of a piezoelectric drivingdevice, a manufacturing method of a piezoelectric driving device, and arobot including a piezoelectric driving device mounted thereon, inaddition to the piezoelectric driving device.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIGS. 1A and 1B are respectively a plan view and a sectional viewshowing a schematic configuration of a piezoelectric driving device of afirst embodiment.

FIG. 2 is a plan view of a vibrating plate.

FIG. 3 is an explanatory diagram showing an electrical connection stateof the piezoelectric driving device and a driving circuit.

FIGS. 4A to 4C are explanatory diagrams showing an example of operationsof the piezoelectric driving device.

FIG. 5 is a sectional view of a piezoelectric vibrating body.

FIG. 6 is a flowchart showing manufacturing of the piezoelectric drivingdevice.

FIGS. 7A to 7H are explanatory diagrams showing a manufacturing processof the piezoelectric vibrating body in Step S100 of FIG. 6.

FIGS. 8A to 8C are explanatory diagrams showing a process subsequent tothe process of FIG. 7H.

FIGS. 9A to 9E are plan views showing an example of various wiringlayers or insulating layers.

FIGS. 10A and 10B are plan views showing an example of a wiring patternformed on a vibrating plate.

FIGS. 11A and 11B are plan views showing another example of the wiringpattern formed on the vibrating plate.

FIGS. 12A and 12B are schematic views of a laminated wiring structure ofthe piezoelectric driving device.

FIG. 13 is a circuit diagram showing the piezoelectric element and anequivalent circuit such as a driving circuit.

FIGS. 14A and 14B are schematic views showing another laminated wiringstructure.

FIGS. 15A to 15C are plan views of a piezoelectric driving device ofanother embodiment.

FIG. 16 is an explanatory diagram showing an example of a robot usingthe piezoelectric driving device.

FIG. 17 is an explanatory diagram of a wrist part of a robot.

FIG. 18 is an explanatory diagram showing an example of a liquid feedingpump using the piezoelectric driving device.

DESCRIPTION OF EXEMPLARY EMBODIMENTS First Embodiment

FIG. 1A is a plan view showing a schematic configuration of apiezoelectric driving device 10 of a first embodiment of the inventionand FIG. 1B is a sectional view taken along line B-B. A piezoelectricdriving device 10 includes a vibrating plate 200, and two piezoelectricvibrating bodies 100 respectively disposed on both surfaces (a firstsurface 211 and a second surface 212) of the vibrating plate 200. Eachof the piezoelectric vibrating bodies 100 include a substrate 120, afirst electrode 130 formed on the substrate 120, a piezoelectric body140 formed on the first electrode 130, and a second electrode 150 formedon the piezoelectric body 140. The first electrode 130 and the secondelectrode 150 configure piezoelectric elements by interposing thepiezoelectric body 140 therebetween. The two piezoelectric vibratingbodies 100 are symmetrically disposed with the vibrating plate 200 as acenter. In the embodiment, the piezoelectric vibrating body 100 isinstalled on the vibrating plate 200 so that the piezoelectric elements(130, 140, and 150) are interposed between the substrate 120 and thevibrating plate 200. Since the two piezoelectric vibrating bodies 100have the same configuration, the configuration of the piezoelectricvibrating body 100 on the lower side of the vibrating plate 200 will bedescribed hereinafter, unless otherwise noted.

The substrate 120 of the piezoelectric vibrating body 100 is used as asubstrate for forming the first electrode 130, the piezoelectric body140, and the second electrode 150 in a film forming process. Thesubstrate 120 also has a function as a vibrating plate which performsmechanical vibration. The substrate 120 can be formed of Si, Al₂O₃, orZrO₂, for example. As the substrate 120 formed of Si, a Si wafer forsemiconductor manufacturing can be used, for example. In the embodiment,a planar shape of the substrate 120 is a rectangle. A thickness of thesubstrate 120 is, for example, preferably in a range of 10 μm to 100 μm.When the thickness of the substrate 120 is equal to or greater than 10μm, it is possible to comparatively easily treat the substrate 120, atthe time of performing a film forming process on the substrate 120. Whenthe thickness of the substrate 120 is equal to or smaller than 100 μm,it is possible to easily vibrate the substrate 120 according toexpansion and contraction of the piezoelectric body 140 formed of a thinfilm.

The first electrode 130 is formed as one continuous conductor layerwhich is formed on the substrate 120. Meanwhile, as shown in FIG. 1A,the second electrode 150 is divided into five conductor layers 150 a to150 e (also referred to as “second electrodes 150 a to 150 e”). Thesecond electrode 150 e in the center is formed to have a rectangularshape over substantially all of the substrate 120 in a longitudinaldirection, in the center of the substrate 120 in a width direction. Theother four second electrodes 150 a, 150 b, 150 c, and 150 d have thesame planar shape and are formed at four corners of the substrate 120.In the example of FIGS. 1A and 1B, both the first electrode 130 and thesecond electrode 150 have a rectangular planar shape. The firstelectrode 130 or the second electrode 150 is a thin film which is formedby sputtering, for example. As a material of the first electrode 130 orthe second electrode 150, any material having high conductivity such asAl (aluminum), Ni (nickel), Au (gold), Pt (platinum), or Ir (iridium)can be used, for example. In addition, instead of setting the firstelectrode 130 as one continuous conductor layer, the first electrode maybe divided into five conductor layers having planar shapes which aresubstantially the same as those of the second electrodes 150 a to 150 e.Wiring (or a wiring layer or an insulating layer) for electricallyconnecting the second electrodes 150 a to 150 e with each other andwiring (or a wiring layer or an insulating layer) for electricallyconnecting the first electrode 130, the second electrodes 150 a to 150e, and a driving circuit with each other are not shown in FIGS. 1A and1B.

The piezoelectric body 140 is formed as five piezoelectric layers havingplanar shapes which are substantially the same as those of the secondelectrodes 150 a to 150 e. Instead of that, the piezoelectric body 140may be formed as one continuous piezoelectric layer having a planarshape substantially the same as that of the first electrode 130. Fivepiezoelectric elements 110 a to 110 e (FIG. 1A) are configured by thelaminated structure of the first electrode 130, the piezoelectric body140, and the second electrodes 150 a to 150 e.

The piezoelectric body 140 is a thin film which is formed by a sol-gelmethod or a sputtering method, for example. As a material of thepiezoelectric body 140, any material exhibiting a piezoelectric effectsuch as ceramics having an ABO₃ type perovskite structure can be used.Examples of the ceramics having an ABO₃ type perovskite structureinclude lead zirconate titanate (PZT), barium titanate, lead titanate,potassium niobate, lithium niobate, lithium tantalate, sodium tungstate,zinc oxide, barium strontium titanate (BST), strontium bismuth tantalate(SBT), lead metaniobate, zinc niobate lead, and scandium niobate. As amaterial exhibiting a piezoelectric effect other than the ceramics,polyvinylidene fluoride or crystal can also be used, for example. Athickness of the piezoelectric body 140 is, for example, preferably in arange of 50 nm (0.05 μm) to 20 μm. A thin film of the piezoelectric body140 having a thickness of this range can easily be formed by using afilm forming process. When the thickness of the piezoelectric body 140is equal to or greater than 0.05 μm, it is possible to generatesufficiently great power according to expansion and contraction of thepiezoelectric body 140. When the thickness of the piezoelectric body 140is equal to or smaller than 20 μm, it is possible to sufficientlyminiaturize the piezoelectric driving device 10.

FIG. 2 is a plan view of the vibrating plate 200. The vibrating plate200 includes a rectangular vibrator portion 210, three connectionportions 220 which extend from right and left long sides of the vibratorportion 210, and two attachment portions 230 which are connected to therespective three connection portions 220 on both right and left sides.In FIG. 2, for convenience of description, an area of the vibratorportion 210 is hatched. The attachment portions 230 are used forattaching the piezoelectric driving device 10 to another member withscrews 240. The vibrating plate 200, for example, can be formed with ametal material such as stainless steel, aluminum, an aluminum alloy,titanium, a titanium alloy, copper, a copper alloy, or an iron-nickelalloy.

The piezoelectric vibrating bodies 100 (FIGS. 1A and 1B) arerespectively mounted on an upper surface (first surface 211) and a lowersurface (second surface 212) of the vibrator portion 210 using anadhesive. A ratio of a length L and a width W of the vibrator portion210 is preferably approximately L:W=about 7:2. This ratio is apreferable value for performing ultrasonic vibration (which will bedescribed later) in which the vibrator portion 210 curves to the rightand left along the flat surface thereof. The length L of the vibratorportion 210 can be set, for example, in a range of 3.5 mm to 30 mm andthe width W thereof can be set, for example, in a range of 1 mm to 8 mm.Since the vibrator portion 210 performs ultrasonic vibration, the lengthL thereof is preferably equal to or smaller than 50 nm. A thickness ofthe vibrator portion 210 (thickness of vibrating plate 200) can be set,for example, in a range of 50 μm to 700 μm. When the thickness of thevibrator portion 210 is equal to or greater than 50 μm, sufficientrigidity for supporting the piezoelectric body 100 is obtained. When thethickness of the vibrator portion 210 is equal to or smaller than 700μm, sufficiently great deformation can occur according to deformation ofthe piezoelectric body 100.

A protrusion 20 (also referred to as a “contacting portion” or an“operating portion”) is provided on one short side of the vibratingplate 200. The protrusion 20 is a member which comes in contact with abody to be driven to apply force to a body to be driven. The protrusion20 is preferably formed of a material having durability such as ceramics(for example, Al₂O₃).

FIG. 3 is an explanatory diagram showing an electrical connection stateof the piezoelectric driving device 10 and a driving circuit 300. Amongthe five second electrodes 150 a to 150 e, a pair of diagonal secondelectrodes 150 a and 150 d are electrically connected to each otherthrough a wiring 151, and another pair of diagonal second electrodes 150b and 150 c are also electrically connected to each other through awiring 152. The wirings 151 and 152 may be formed by a film formingprocess or may be implemented by wire-shaped wiring. The three secondelectrodes 150 b, 150 e, and 150 d disposed on the right side of FIG. 3and the first electrode 130 (FIGS. 1A and 1B) are electrically connectedto the driving circuit 300 through wirings 310, 312, 314, and 320. Byapplying an AC voltage or an undulating voltage which periodicallychanges, between a pair of second electrodes 150 a and 150 d and thefirst electrode 130, the driving circuit 300 can cause the piezoelectricdriving device 10 to perform ultrasonic vibration and rotate a rotor(body to be driven) which comes in contact with the protrusion 20, in apredetermined rotation direction. Herein, the “undulating voltage” meansa voltage obtained by applying DC offset to the AC voltage, and adirection of the voltage (electric field) thereof is a direction fromone electrode to the other electrode. In addition, by applying an ACvoltage or an undulating voltage between another pair of secondelectrodes 150 b and 150 c and the first electrode 130, a rotor whichcomes in contact with the protrusion 20 can be rotated in a reversedirection. The application of the voltage can be simultaneouslyperformed on the two piezoelectric vibrating bodies 100 provided on bothsurfaces of the vibrating plate 200. A wiring (or a wiring layer or aninsulating layer) configuring the wirings 151, 152, 310, 312, 314, and320 shown in FIG. 3 is not shown in FIGS. 1A and 1B.

In the embodiment shown in FIG. 3, the five piezoelectric elements 110 ato 110 e are divided into the following three sets of piezoelectricelement groups.

(1) first piezoelectric element group PG1: piezoelectric elements 110 aand 110 d

(2) second piezoelectric element group PG2: piezoelectric elements 110 band 110 c

-   -   (3) third piezoelectric element group PG3: piezoelectric element        110 e

The piezoelectric element 110 included in each piezoelectric elementgroup is driven at the same time in any case. Since the firstpiezoelectric element group PG1 includes the two piezoelectric elements110 a and 110 d, the second electrodes 150 a and 150 d of thepiezoelectric elements 110 a and 110 d are directly connected to eachother through a connection wiring 151. The same applies to the secondpiezoelectric element group PG2. As another embodiment, one set of thepiezoelectric element group can also be configured with three or morepiezoelectric elements 110, and in general, the plurality ofpiezoelectric elements can be divided into N sets (N is an integer equalto or larger than 2) of the piezoelectric element groups. In this case,when two or more piezoelectric elements 110 are included in the samepiezoelectric element group, the second electrodes 150 are directlyconnected to each other through a connection wiring. Herein, “to bedirectly connected through a connection wiring” means that theconnection wiring does not include a passive element (a resistor, acoil, or a capacitor) or an active element. In the embodiment, oneconductor layer common to the five piezoelectric elements 110 a to 110 eis used as the first electrode 130, but when the first electrode 130 isseparate for each piezoelectric element, it is preferable that the firstelectrodes of the two or more piezoelectric elements belonging to thesame piezoelectric element group are also directly connected to eachother through a connection wiring.

FIGS. 4A to 4C are explanatory diagrams showing an example of operationsof the piezoelectric driving device 10. The protrusion 20 of thepiezoelectric driving device 10 comes in contact with an outercircumference of a rotor 50 which is a body to be driven. In an exampleshown in FIG. 4A, the driving circuit 300 (FIG. 3) applies an AC voltageor an undulating voltage between a pair of second electrodes 150 a and150 d and the first electrode 130, and accordingly, the piezoelectricelements 110 a and 110 d expand or contract in a direction of an arrow xshown in FIG. 4A. According to this, the vibrator portion 210 of thepiezoelectric driving device 10 curves in a flat surface of the vibratorportion 210 to be deformed in a meander shape (S shape), and a tip endof the protrusion 20 performs a reciprocal operation or an ellipticoperation in a direction of an arrow y. As a result, the rotor 50 isrotated around the center 51 thereof in a predetermined direction z(clockwise in FIG. 4A). The three connection portions 220 (FIG. 2) ofthe vibrating plate 200 described in FIG. 2 are provided at a positionof a node of vibration of the vibrator portion 210. When the drivingcircuit 300 applies an AC voltage or an undulating voltage betweenanother pair of second electrodes 150 b and 150 c and the firstelectrode 130, the rotor 50 is rotated in a reverse direction. When thesame voltage as that applied to a pair of second electrodes 150 a and150 d (or another pair of second electrodes 150 b and 150 c) is appliedto the second electrode 150 e in the center, the piezoelectric drivingdevice 10 expands and contracts in a longitudinal direction, andaccordingly, it is possible to increase the magnitude of force appliedto the rotor 50 from the protrusion 20. Such an operation regarding thepiezoelectric driving device 10 (or piezoelectric vibrating body 100) isdisclosed in JP-A-2004-320979 or U.S. Pat. No. 7,224,102 thereof, andthe disclosed content thereof is incorporated by reference.

FIG. 4B shows a state where the piezoelectric driving device 10 alsocurves in a thickness direction when being vibrated in a plane directionthereof, as shown in FIG. 4A. The curvature in such a thicknessdirection is not desirable, because distortion may occur on the surfaceof the piezoelectric driving device 10. However, in the piezoelectricdriving device 10 of the embodiment, since the piezoelectric vibratingbody 100 is provided on the vibrating plate 200 so that thepiezoelectric elements (130, 140, and 150) are interposed between thesubstrate 120 and the vibrating plate 200, it is possible to preventsuch undesirable distortion by the substrate 120. In the opposite mannerto the example of FIG. 4B, FIG. 4C shows an example in which thepiezoelectric vibrating body 100 is installed on the vibrating plate 200so that the substrate 120 comes in contact with the vibrating plate 200.In a laminated structure of FIG. 4C, undesirable distortion may beexcessively increased on the surface of the second electrode 150.Accordingly, as shown in FIG. 4B, the piezoelectric vibrating body 100is preferably installed on the vibrating plate 200 so that thepiezoelectric elements (130, 140, and 150) are interposed between thesubstrate 120 and the vibrating plate 200. By doing so, it is possibleto decrease a possibility of break-down or damaging of the piezoelectricdriving device 10. Particularly, the substrate 120 is preferably formedof silicon, because the substrate is hardly damaged due to distortion.

FIG. 5 is a sectional view more specifically showing an example of asectional structure of the piezoelectric vibrating body 100 shown inFIG. 1B. The piezoelectric vibrating body 100 includes the substrate120, an insulating layer 125, the first electrode 130, the piezoelectricbody 140, the second electrodes 150, insulating layers 160, and alaminated conducting portion 172. In FIG. 5, regarding the plurality ofsecond electrodes 150 and the plurality of laminated conducting portions172, an index “c” or “d” is used for distinction. In FIG. 5, the wirings151 and 152 shown in FIG. 3 are not shown. In this specification, anexpression of the “laminated conducting portion” means a conductor whichis formed by a film forming process (laminating process) such as vapordeposition, sputtering, ion plating, or plating.

The insulating layer 125 is formed on the substrate 120 and insulatesthe substrate 120 and the first electrode 130 from each other. The firstelectrode 130 is formed on the insulating layer 125. The piezoelectricbody 140 is formed on the first electrode 130. The second electrode 150is formed on the piezoelectric body 140. The insulating layer 160 isformed on the second electrode 150. In a plan view, the first electrode130 preferably has a portion not overlapping the piezoelectric body 140(in FIG. 5, a portion of the piezoelectric body 140 exposed to the leftand right sides). The reason thereof is because the first electrode 130is easily connected to a wiring pattern (which will be described later)formed on the vibrating plate 200. The laminated conducting portion 172is connected with the first electrode 130. The insulating layer 160 hasopenings (contact holes) on some parts thereof, so that the laminatedconducting portion 172 comes into contact with the second electrode 150.In addition, a plurality of contact holes are preferably formed on theinsulating layer 160. This point will be further described later.

FIG. 6 is a flowchart showing manufacturing of the piezoelectric drivingdevice 10. In Step S100, the piezoelectric elements 110 are formed onthe substrate 120, and accordingly, the piezoelectric vibrating body 100is formed. At that time, an Si wafer can be used, as the substrate 120,for example. The plurality of piezoelectric vibrating bodies 100 can beformed on one Si wafer. In addition, since Si has a great value of amechanical quality factor Qm which is approximately 100,000, it ispossible to increase the mechanical quality factor Qm of thepiezoelectric vibrating body 100 or the piezoelectric driving device 10.In Step S200, the substrate 120 formed on the piezoelectric vibratingbody 100 is diced and divided into each of the piezoelectric vibratingbodies 100. A rear surface of the substrate 120 may be ground beforedicing the substrate 120 to have a desired thickness of the substrate120. In Step S300, the two piezoelectric vibrating bodies 100 are bondedto both surfaces of the vibrating plate 200 with an adhesive. In StepS400, a wiring layer of the piezoelectric vibrating bodies 100 and thedriving circuit are electrically connected to each other.

FIGS. 7A to 7H are explanatory diagrams showing a manufacturing processof the piezoelectric vibrating body 100 in Step S100 of FIG. 6. FIGS. 7Ato 7H show a process of forming the piezoelectric element 110 d shown onthe upper right portion of FIG. 5 on the substrate 120. In Step S110,the substrate 120 is prepared and the insulating layer 125 is formed onthe surface of the substrate 120. An SiO₂ layer which is formed bythermal oxidation of the surface of the substrate 120 can be used, forexample, as the insulating layer 125. In addition, an organic materialsuch as alumina (Al₂O₃), acryl or polyimide can be used as theinsulating layer. When the substrate 120 is an insulator, a step offorming the insulating layer 125 can be omitted.

In Step S120, the first electrode 130 is formed on the insulating layer125. The first electrode 130 can be formed by sputtering, for example.

In Step S130, the piezoelectric body 140 is formed on the firstelectrode 130. Specifically, the piezoelectric body 140 can be formedusing a sol-gel method, for example. That is, a sol-gel solution whichis a piezoelectric body material is added dropwise onto the substrate120 (first electrode 130), high-speed rotation of the substrate 120 isperformed, and accordingly, a thin film of the sol-gel solution isformed on the first electrode 130. Then, the thin film is calcined at atemperature of 200° C. to 300° C. to form a first layer of thepiezoelectric body material on the first electrode 130. After that, byrepeating the cycle of the dropping of the sol-gel solution, therapid-speed rotation, and the calcination several times, a piezoelectriclayer having a desired thickness is formed on the first electrode 130. Athickness of one layer of the piezoelectric body formed in one cycledepends on the viscosity of the sol-gel solution or a rotation rate ofthe substrate 120, and is approximately from 50 nm to 150 nm. Afterforming the piezoelectric layer having a desired thickness, thepiezoelectric layer is sintered at a temperature of 600° C. to 1,000° C.to form the piezoelectric body 140. When the thickness of thepiezoelectric body 140 after sintering is set to be from 50 nm (0.05 μm)to 20 μm it is possible to implement the miniaturized piezoelectricdriving device 10. When the thickness of the piezoelectric body 140 isset to be equal to or greater than 0.05 μm, it is possible to generate asufficiently great enough force according to the expansion andcontraction of the piezoelectric body 140. When the thickness of thepiezoelectric body 140 is set to be equal to or smaller than 20 μm, itis possible to generate a sufficiently great enough force, even when avoltage to be applied to the piezoelectric body 140 is equal to orsmaller than 600 V. As a result, it is possible to configure the drivingcircuit 300 for driving the piezoelectric driving body 10 with aninexpensive element. The thickness of the piezoelectric body may beequal to or greater than 8 μm and in this case, it is possible toincrease an amount of force generated by the piezoelectric element. Thetemperature or time of calcining or sintering is merely an example andis appropriately selected depending on the piezoelectric body material.

When the thin film of the piezoelectric body material is formed andsintered using a sol-gel method, there are advantages that (a) a thinfilm is easily formed, (b) crystallization is easily performed in agrating direction, and (c) withstanding pressure of the piezoelectricbody can be improved, when compared to a sintering method of the relatedart of mixing and sintering raw material powder.

In Step S140, the second electrode 150 is formed on the piezoelectricbody 140. In the same manner as in the case of the first electrode, theformation of the second electrode 150 can be performed by sputtering.

In Step S150, the second electrode 150 and the piezoelectric body 140are patterned. In the embodiment, by performing ion milling using anargon ion beam, the patterning of the second electrode 150 and thepiezoelectric body 140 is performed. By controlling the time of ionmilling, only the second electrode 150 and the piezoelectric body 140may be patterned and the first electrode 130 may not be patterned.Instead of performing the patterning using ion milling, the patterningmay be performed by other arbitrary patterning methods (for example, dryetching using chlorinated gas).

In Step S160, the insulating layer 160 is formed on the first electrode130 and the second electrode 150. As the insulating layer 160, aphosphorous-containing silicon oxide film (PSG film), aboron.phosphorous-containing silicon oxide film (BPSG film), a siliconoxide film not containing impurities such as boron or phosphorous (NSGfilm), or a silicon nitride film (Si₃N₄ film) can be used. Theinsulating layer 160 can be formed by a CVD method, for example. Afterforming the insulating layer 160, patterning is performed for formingthe plurality of contact holes 160 c for connection of the secondelectrode 150.

In Step S170, the conductor layer is formed and patterning is performed.This conductor layer can be formed using aluminum, for example, and isformed by sputtering. After that, by patterning the conductor layer, thesecond laminated conducting portion 172 connected to the secondelectrode 150 is formed.

FIGS. 8A to 8C are explanatory diagrams showing a process subsequent tothe process of FIG. 7H. In FIG. 8A, an insulating layer 260 is formed onthe laminated structure of FIG. 7H and the plurality of contact holes260 c are formed by patterning the insulating layer. In FIG. 8B, asecond laminated conducting portion 272 is formed over the entiresurface of the laminated structure by sputtering. By performing thesteps in FIGS. 7A to 8B, the formation of the piezoelectric vibratingbody 100 in which the second laminated conducting layers 172 and 272connected to the second electrode 150 are formed, is completed on thepiezoelectric elements (130, 140, and 150). Also, regarding the firstelectrode 130, one or more first laminated conducting portions connectedto the first electrode 130 are formed, but are omitted in FIGS. 7A to8C.

FIG. 8C shows a process of bonding the piezoelectric vibrating body 100to the vibrating plate 200 in Step S300 of FIG. 6. Before the Step Shownin FIG. 8C, an insulating layer 202 is formed on the surface of thevibrating plate 200 and a wiring pattern including a wiring 332 isformed on the insulating layer 202. The insulating layer 202 can beformed by applying an insulating resin such as polyimide, for example.In FIG. 8C, the piezoelectric vibrating body 100 manufactured byperforming the processes of FIGS. 7A to 8C is attached to the vibratingplate 200 using an adhesive. At that time, the piezoelectric vibratingbody 100 is installed on the vibrating plate 200 so that thepiezoelectric elements (130, 140, and 150) are interposed between thesubstrate 120 of the piezoelectric vibrating body 100 and the vibratingplate 200. In FIG. 8C, another piezoelectric vibrating body 100 attachedto the lower surface of the vibrating plate 200 is omitted.

FIGS. 9A to 9E are plan views showing an example of various wiringlayers and insulating layers shown in FIG. 8C. These are arranged in theorder of lamination and each layer will be described in the order fromFIG. 9E showing the lowermost layer to FIG. 9A showing the uppermostlayer. FIG. 9E shows a conducting layer pattern including the secondelectrode 150. This conducting layer pattern includes five secondelectrodes 150 a to 150 e for the five piezoelectric elements 110 a to110 e (FIG. 3) and further includes a first laminated conducting portion150 g surrounding the outer circumference thereof. This first laminatedconducting portion 150 g is connected to the first electrode 130. Thefive second electrodes 150 a to 150 e and the first laminated conductingportion 150 g are separated from each other and are insulated from eachother by an insulating layer, but the insulating layer is omitted inFIG. 9E. In FIGS. 7A to 8C described above, the first laminatedconducting portion 150 g is omitted. Various patterns for the firstelectrode 130 which is provided on each layer of FIGS. 9A to 9Ddescribed below are also omitted in FIGS. 7A to 8C.

FIG. 9D shows the insulating layer 160 which is formed on the conductinglayer pattern of the second electrode 150. A broken line shows anoutline of the five second electrodes 150 a to 150 e of FIG. 9E forreference. As described in FIG. 7G, the plurality of contact holes 160 care formed on the insulating layer 160. More specifically, the contactholes 160 c are substantially evenly formed over the entire area of fiveareas corresponding to the five second electrodes 150 a to 150 e. Theplurality of contact holes 160 c are also formed in an areacorresponding to the first laminated conducting portion 150 g for thefirst electrode 130. The first laminated conducting portion 150 g isformed along all of the four sides of the substrate 120 and theplurality of contact holes 160 c are formed in areas corresponding tothree sides among the four sides.

FIG. 9C shows a conducting pattern 170 which is formed on the insulatinglayer 160. This conducting pattern 170 is a conducting pattern which isin a position closest to the second electrode 150 in a laminationdirection. The conducting pattern 170 includes one first laminatedconducting portion 171 which is connected to the first electrode 130,and five second laminated conducting portions 172 a to 172 e which areconnected to the five second electrodes 150 a to 150 e. The firstlaminated conducting portion 171 is connected to the first electrode 130through the plurality of contact holes 160 c of the insulating layer 160and the first laminated conducting portion 150 g (FIG. 9E) on the lowerlayer side. In addition, the five second laminated conducting portions172 a to 172 e are respectively connected to the second electrodes 150 ato 150 e through the plurality of contact holes 160 c of the insulatinglayer 160.

FIG. 9B shows the insulating layer 260 which is formed on the conductingpattern 170. A broken line shows an outline of the second laminatedconducting portions shown in FIG. 9A for reference. As described in FIG.8A, the plurality of contact holes 260 c are formed on the insulatinglayer 260.

FIG. 9A shows a conducting pattern 270 which is formed on the uppermostportion of the piezoelectric vibrating body 100. This conducting pattern270 is a conducting pattern 270 which is in a position farthest from thesubstrate 120 in the lamination direction. The conducting pattern 270includes a first laminated conducting portion 271 which is connected tothe first electrode 130 and three second laminated conducting portions272 ad, 272 bc, and 272 e which are connected to three sets of thesecond electrodes (150 a+150 d), (150 b+150 c), and 150 e correspondingto the three sets of the piezoelectric element groups PG1, PG2, and PG3described in FIG. 3.

The second laminated conducting portion 272 ad for the firstpiezoelectric element group PG1 is connected to the two second laminatedconducting portions 172 a and 172 d of FIG. 9C through the plurality ofcontact holes 260 c of the insulating layer 260 of FIG. 9B, andaccordingly, the second laminated conducting portion 272 ad is furtherconnected to the two second electrodes 150 a and 150 d through theplurality of contact holes 160 c of the insulating layer 160 of FIG. 9D.The second laminated conducting portion 272 ad is extended from an areacorresponding to the second laminated conducting portion 172 a of FIG.9C to an area corresponding to the second laminated conducting portion172 d through areas corresponding to the other two adjacent secondlaminated conducting portions 172 e and 172 c in this order, to beconnected to the two second laminated conducting portions 172 a and 172d of FIG. 9C. An area of the second laminated conducting portion 272 adwhich is on the upper part of the second laminated conducting portions172 e and 172 c not electrically connected to the second laminatedconducting portion 272 ad, corresponds to the connection wiring 151shown in FIG. 3. In the insulating layer 260 of FIG. 9B, the contactholes 260 c are formed only in a part of the area (shown with a brokenline) corresponding to the second laminated conducting portion 272 adwhich corresponds to the second laminated conducting portions 172 a and172 d connected to the second laminated conducting portion 272 ad. As aresult, it is possible to form a connection structure in which thesecond laminated conducting portion 272 ad is connected to the secondlaminated conducting portions 172 a and 172 d on the lower layer sideand is not connected to the other laminated conducting portions 171, 172b, 172 c, and 172 e on the lower layer side. The connection structurerelating to the second laminated conducting portion 272 ad for the firstpiezoelectric element group PG1 is substantially the same as that of thesecond laminated conducting portion 272 bc for the second piezoelectricelement group PG2. In addition, these two second laminated conductingportions 272 ad and 272 bc do not intersect each other and are separatedand insulated from each other.

The second laminated conducting portion 272 e for the thirdpiezoelectric element group PG3 is connected to the second laminatedconducting portion 172 e of FIG. 9C through the plurality of contactholes 260 c of the insulating layer 260 of FIG. 9B, and accordingly, thesecond laminated conducting portion 272 e is further connected to thesecond electrode 150 e through the plurality of contact holes 160 c ofthe insulating layer 160 of FIG. 9D. This second laminated conductingportion 272 e does not intersect the other two second laminatedconducting portions 272 ad and 272 bc, either, and these are separatedand insulated from each other. As described above, in the embodiment,the three second laminated conducting portions 272 ad, 272 bc, and 272 eare provided in a state of being insulated from each other, tocorrespond to the three sets of piezoelectric element groups PG1, PG2,and PG3. As a result, it is possible to separately drive the three setsof piezoelectric element groups PG1, PG2, and PG3. In general, when theplurality of piezoelectric elements 110 are divided into N sets (N is aninteger equal to or larger than 2) of the piezoelectric element groups,the second laminated conducting portions are preferably provided in astate of being insulated from each other.

The first laminated conducting portion 271 for the first electrode 130is connected to the first laminated conducting portion 171 of FIG. 9Cthrough the plurality of contact holes 260 c of the insulating layer 260of FIG. 9B, accordingly, is further connected to the first laminatedconducting portion 150 g of FIG. 9E through the plurality of contactholes 160 c of the insulating layer 160 of FIG. 9D, and is connected tothe first electrode 130 through the first laminated conducting portion150 g.

FIGS. 10A and 10B are explanatory diagrams showing an example of awiring pattern 330 formed on the vibrating plate 200. The wiring pattern330 includes a first wiring 331 which is connected to the firstlaminated conducting portion 271 shown in FIG. 9A, and second wirings332 ad, 332 bc, and 332 e which are connected to the second laminatedconducting portions 272 ad, 272 bc, and 272 e. The four kinds of thewirings 331, 332 ad, 332 bc, and 332 e are connected to the four kindsof the laminated conducting portions 271, 272 ad, 272 bc, and 272 e ofFIG. 9A so that the surfaces thereof come into contact with each other.When the piezoelectric vibrating body 100 is bonded to the vibratingplate 200 (FIG. 8C), the wirings come in contact with the conductingpattern 270 of FIG. 9A in a horizontally inverted state of FIGS. 10A and10B.

In general, when the plurality of piezoelectric elements 110 are dividedinto N sets (N is an integer equal to or larger than 2) of thepiezoelectric element groups, N second conducting portions arepreferably provided on the uppermost layer on the piezoelectricvibrating body 100 side so as to be insulated from each other, andmeanwhile, the corresponding N second wirings are preferably provided onthe wiring pattern 330 of the vibrating plate 200 so as to be insulatedfrom each other. By doing so, the vibrating plate 200 and thepiezoelectric vibrating body 100 are bonded to each other so that thesurfaces thereof come into contact with each other, and accordingly, itis possible to easily perform wiring connection.

Among the wiring pattern 330 on the vibrating plate 200, the threesecond wirings 332 ad, 332 bc, and 332 e for the three sets of thepiezoelectric element groups PG1, PG2, and PG3 are extended to aposition of the attachment portion 230 through the connection portion220 which is on one side (upper side of FIG. 10A) of the vibrating plate200. This is because the second wirings 332 ad, 332 bc, and 332 e areconnected to the driving circuit 300 (FIG. 3) at the position of theattachment portion 230. The first wiring 331 for the first electrode 130is extended to a position of the attachment portion 230 through theconnection portion 220 which is on the other side (lower side of FIG.10A) of the vibrating plate 200. This is because the first wiring 331 isconnected to the driving circuit 300 at the position of the attachmentportion 230. These wirings 331, 332 ad, 332 bc, and 332 e arerespectively connected to the wirings 320, 314, 310, and 312 shown inFIG. 3. As described above, the wiring pattern 330 (331, 332 ad, 332 bc,and 332 e) on the vibrating plate 200 is preferably formed to beextended to a surface part where the piezoelectric vibrating body 100 isnot loaded. By doing so, it is possible to easily connect the electrodes130 and 150 of the piezoelectric element 110 and the driving circuit300.

As described above, the wirings 331, 332 ad, 332 bc, and 332 e formed onthe vibrating plate 200 are electrically connected to the laminatedconducting portions 271, 272 ad, 272 bc, and 272 e which are on theuppermost part of the piezoelectric vibrating body 100 so that thesurfaces thereof come into contact with each other. Accordingly, it ispossible to decrease a possibility of disconnection during an operation,compared to a case of performing the electrical connection using a leadwire and soldering. In addition, it is possible to implement spacesaving, compared to a case of using a lead wire. Since the wiringconnection operation between the vibrating plate 200 and thepiezoelectric vibrating body 100 is performed by only bonding thesurfaces thereof to each other, it is possible to shorten the time forwiring and it is possible to prevent variation depending on an operator,because the operation is simple. Since the electrodes 130 and 150 of thepiezoelectric element 110 are interposed between the piezoelectricelement 110 and the vibrating plate 200 and the electrodes 130 and 150are not exposed to the surface on the outer side, defects are decreasedand durability is improved.

FIG. 10B shows a sectional view taken along line B-B of FIG. 10A. Amongthe wiring pattern 330 on the vibrating plate 200, the first wiring 331for the first electrode 130 is extended to the side surface of thevibrating plate 200. In the embodiment, the vibrating plate 200 isformed of a conductive member such as a metal material. Accordingly, thefirst wiring 331 is electrically connected to the vibrating plate 200 onthe side surface of the vibrating plate 200. As a result, it is possibleto easily electrically connect the first electrode 130 of thepiezoelectric element 110 and the vibrating plate 200. However, thefirst wiring 331 may be formed so as not to be extended to the sidesurface of the vibrating plate 200.

FIGS. 11A and 11B are explanatory diagrams showing another example ofthe wiring pattern 330 formed on the vibrating plate 200. Herein, aninsulating layer 340 is further formed on the wiring pattern 330 ofFIGS. 10A and 10B and openings 340 w are provided on the plurality ofparts of the insulating layer 340. As shown in FIG. 11B, some of thewirings 331, 332 ad, 332 bc, and 332 e are exposed from the openings 340w. The parts of the wirings 331, 332 ad, 332 bc, and 332 e exposed fromthe openings 340 w function as pads, and are electrically connected tothe laminated conducting portions 271, 272 ad, 272 bc, and 272 e whichare on the uppermost part of the piezoelectric vibrating body 100 sothat the surfaces thereof come into contact with each other. Asdescribed above, the wiring pattern 330 may be covered with theinsulating layer 340 and only the necessary wiring parts as pads may beexposed from the insulating layer 340. By doing so, a degree of freedomof the shape of the wiring pattern 330 increases, and accordingly, it ispossible to more easily form the wiring pattern 330. Instead of allowingsome of the wirings 331, 332 ad, 332 bc, and 332 e to be exposed fromthe openings 340 w of the insulating layer 340, the openings 340 w maybe filled with solder paste or solder grains. In this case, it ispossible to implement the wiring connection by performing solder reflowafter loading the piezoelectric vibrating body 100 on the vibratingplate 200.

FIGS. 12A and 12B are schematic views of a laminated wiring structure ofthe piezoelectric driving device 10. Herein, the drawings also show acorrespondence relationship with the laminated wiring structuredescribed in FIGS. 8C to 10B. For convenience of description, FIGS. 12Aand 12B show only one piezoelectric element 110 on the substrate 120 andFIG. 12A shows a state where the piezoelectric vibrating body 100 andthe vibrating plate 200 are separated from each other. The insulatinglayer 202 is formed on the surface of the vibrating plate 200 and thewiring pattern 330 including the wirings 331 and 332 is formed on theinsulating layer 202. The wiring 332 is a representative of the threesecond wirings 332 ad, 332 bc, and 332 e shown in FIGS. 10A and 10B. Thefirst electrode 130 of the piezoelectric element 110 is connected to afirst laminated conducting portion LC1 through contact holes CH1. Thefirst laminated conducting portion LC1 is a representative of the firstlaminated conducting portions 171 and 271 which are two layers shown inFIGS. 9A to 9E. The second wiring 150 of the piezoelectric element 110is connected to a second laminated conducting portion LC2 throughcontact holes CH2. The second laminated conducting portion LC2 is arepresentative of the second laminated conducting portions 172 and 272which are two layers shown in FIGS. 9A to 9E. The contact holes CH1 andCH2 are a representative of the contact holes 160 c and 260 c of the twoinsulating layers 160 and 260 shown in FIGS. 9A to 9E.

FIG. 12B shows a plan view of FIG. 12A. The plurality of contact holesCH1 for the first electrode 130 are evenly formed along the entirecircumference of the first electrode 130. The plurality of contact holesCH2 for the second electrode 150 are evenly formed over the entire areaof the second electrode 150. As shown in the schematic view, when theplurality of contact holes CH1 and CH2 are formed, there are effectsthat parasitic resistance is decreased and a voltage applied to bothends of the piezoelectric element 110 is not excessively decreased, aswill be described below.

FIG. 13 is a circuit diagram showing the piezoelectric element 110 andan equivalent circuit such as the driving circuit 300. The piezoelectricelement 110 is equivalent to a series connection of a parasitic resistorR1 of the first electrode 130, a capacitance C of the piezoelectric body140, and a parasitic resistor R2 of the second electrode 150. An ACvoltage or an undulating voltage is supplied from the driving circuit300 to the piezoelectric element 110 as a driving voltage Vd. At thattime, a voltage Vc applied to the piezoelectric element 110 isVd/{1+jω(R1+R2)}. As shown in FIGS. 12A and 12B, when the electrodes 130and 150 are connected to the laminated conducting portions LC1 and LC2using the plurality of contact holes CH1 and CH2, it is possible todecrease the parasitic resistor R1 of the first electrode 130 or theparasitic resistor R2 of the second electrode 150, and accordingly, itis possible to increase the voltage Vc applied to the piezoelectricelement 110 and to more efficiently drive the piezoelectric element 110.A large area of the contact holes CH1 and CH2 is preferable, andmeanwhile, it is preferable not to decrease an area of the piezoelectricelement 110 for the contact holes CH1 and CH2. In order to satisfy thesetwo requirements, in a plan view shown in FIG. 12B, the plurality ofcontact holes CH2 are formed over the entire area of the secondelectrode 150 and the plurality of contact holes CH1 are formed over theentire area corresponding to the outer circumference of the secondelectrode 150, regarding the first electrode 130. In order to implementthis configuration, it is preferable to form a frame-shaped areaincluding the entire outer circumference of the second electrode 150 andwhich is present on the outer side of the second electrode 150, as theshape of the first electrode 130.

FIGS. 14A and 14B show a modification example of FIGS. 12A and 12B.Herein, one large contact hole CH1 a is formed by connecting theplurality of contact holes CH1 for the first electrode shown in FIGS.12A and 12B to each other. One large contact hole CH2 a is also formedby connecting the plurality of contact holes CH2 for the secondelectrode in the same manner. Even with such a configuration, it ispossible to obtain the same effects as in a case of the laminated wiringstructure of FIGS. 12A and 12B.

As shown in the schematic views of FIGS. 12A and 12B and FIGS. 14A and14B, the first laminated conducting portion LC1 and the second laminatedconducting portion LC2 can be formed as at least a conducting pattern ofone layer. However, as described in FIG. 8C and FIGS. 9A to 9E, thefirst laminated conducting portion LC1 and the second laminatedconducting portion LC2 may be implemented using the conducting patternof two or more layers (170 and 270 of FIGS. 9A to 9E). In this case, itis preferable that the first laminated conducting portion LC1 (171 and271 of FIGS. 9A to 9E) and the second laminated conducting portion LC2(172 and 272 of FIGS. 9A to 9E) are formed in the conducting pattern ofeach layer (170 and 270 of FIGS. 9A to 9E). When the conducting patternof two or more layers is used, a degree of freedom of the wiringconnection structure increases, compared to a case of using theconducting pattern of only one layer, and accordingly, it is possible tomore easily configure the desired wiring connection structure. When theconducting pattern of two or more layers is provided, it is preferableto provide the insulating layer between the conducting pattern of theadjacent two layers.

As described above, according to the piezoelectric driving device 10 ofthe first embodiment, since the first wiring 331 and the second wiring332 of the wiring pattern 330 of the vibrating plate 200 are connectedto the first electrode 130 and the second electrode 150, it is possibleto save space for the wirings and to decrease a possibility ofdisconnection, compared to a case where the wiring pattern 330 of thevibrating plate 200 is connected with the first electrode 130 and thesecond electrode 150 using a lead wire or soldering. Since the firstwiring 331 and the second wiring 332 are connected to the firstelectrode 130 and the second electrode 150 through the first laminatedconducting portion LC1 (171 and 271) and the second laminated conductingportion LC2 (172 and 272), an effect of decreasing space for wiring andan effect of decreasing a possibility of disconnection are significant.In addition, since the piezoelectric vibrating body 100 is installed onthe vibrating plate 200 so that the piezoelectric element 110 isinterposed between the substrate 120 and the vibrating plate 200, it ispossible to prevent such undesired distortion by the substrate. As aresult, it is possible to decrease a possibility of break-down ordamaging of the piezoelectric driving device 10.

Other Embodiments of Piezoelectric Driving Device

FIG. 15A is a plan view of a piezoelectric driving device 10 b asanother embodiment of the invention and is a diagram corresponding toFIG. 1A of the first embodiment. In FIGS. 15A to 15C, for convenience ofdescription, the connection portion 220 or the attachment portion 230 ofthe vibrating plate 200 is omitted. In the piezoelectric driving device10 b of FIG. 15A, the pair of second electrodes 150 b and 150 c areomitted. This piezoelectric driving device 10 b can also rotate therotor 50 in one direction z as shown in FIG. 4A. Since the same voltageis applied to the three second electrodes 150 a, 150 e, and 150 d ofFIG. 15A, the three second electrodes 150 a, 150 e, and 150 d may beformed as one continuous electrode layer.

FIG. 15B is a plan view of a piezoelectric driving device 10 c as stillanother embodiment of the invention. In the piezoelectric driving device10 c, the second electrode 150 e in the center of FIG. 1A is omitted,and the other four second electrodes 150 a, 150 b, 150 c, and 150 d areformed in a larger area than that of FIG. 1A. The piezoelectric drivingdevice 10 c can also implement substantially the same effects as thoseof the first embodiment.

FIG. 15C is a plan view of a piezoelectric driving device 10 d as stillanother embodiment of the invention. In the piezoelectric driving device10 d, the four second electrodes 150 a, 150 b, 150 c, and 150 d of FIG.1A are omitted and one second electrode 150 e is formed with a largearea. The piezoelectric driving device 10 d is only expanded orcontracted in the longitudinal direction, but it is possible to applygreat force from the protrusion 20 to a body to be driven (not shown).

As shown in FIGS. 1A and 1B and FIGS. 15A to 15C, as the secondelectrode 150 of the piezoelectric vibrating body 100, at least oneelectrode layer can be provided. However, as shown in FIGS. 1A and 1Band FIGS. 15A to 15C, it is preferable to provide the second electrode150 in a position diagonal to the rectangular piezoelectric vibratingbody 100, because it is possible to deform the piezoelectric vibratingbody 100 and the vibrating plate 200 in a meander shape to be curved inthe plane thereof.

Embodiment of Apparatus Using Piezoelectric Driving Device

The piezoelectric driving device 10 described above can apply greatforce to a body to be driven by using resonance, and can be applied tovarious apparatuses. The piezoelectric driving device 10 can be used asa driving device in various apparatuses such as a robot (including anelectronic component conveying apparatus (IC handler), a pump formedication, a calendar transporting apparatus of a clock, and a printingapparatus (for example, a paper feeding mechanism, however, a vibratingplate is not resonated in a piezoelectric driving device used in a head,and accordingly, the piezoelectric driving device is not applied to ahead), for example. Hereinafter, a representative embodiment will bedescribed.

FIG. 16 is an explanatory diagram showing an example of a robot 2050using the piezoelectric driving device 10 described above. The robot2050 includes an arm 2010 (also referred to as an “arm portion”) whichincludes a plurality of linking portions 2012 (also referred to as“linking members”) and a plurality of joints 2020 which are connectedbetween the linking portions 2012 to be rotated or curved. Thepiezoelectric driving device 10 described above is embedded in eachjoint 2020, and it is possible to rotate or curve the joint 2020 by anarbitrary angle using the piezoelectric driving device 10. A robot hand2000 is connected to an end of the arm 2010. The robot hand 2000includes a pair of grasping portions 2003. The piezoelectric drivingdevice 10 is also embedded in the robot hand 2000, and it is possible toopen and close the grasping portions 2003 using the piezoelectricdriving device 10 to grasp an object. In addition, the piezoelectricdriving device 10 is also provided between the robot hand 2000 and thearm 2010, and it is possible to rotate the robot hand 2000 with respectto the arm 2010 using the piezoelectric driving device 10.

FIG. 17 is an explanatory diagram of a wrist part of the robot 2050shown in FIG. 16. The wrist joints 2020 interpose a wrist rotationportion 2022 and a wrist linking portion 2012 is attached to the wristrotation portion 2022 to be rotated around a center axis O of the wristrotation portion 2022. The wrist rotation portion 2022 includes thepiezoelectric driving device 10, and the piezoelectric driving device 10rotates the wrist linking portion 2012 and the robot hand 2000 aroundthe center axis O. The plurality of grasping portions 2003 are providedto stand on the robot hand 2000. A proximal end portion of the graspingportion 2003 can move in the robot hand 2000 and the piezoelectricdriving device 10 is mounted in a base portion of this grasping portion2003. Accordingly, by operating the piezoelectric driving device 10, itis possible to grasp a target by moving the grasping unit 2003.

The robot is not limited to a single arm robot, and the piezoelectricdriving device 10 can also be applied to a multi-arm robot having two ormore arms. Herein, in addition to the piezoelectric driving device 10,an electric power line for applying power to various devices such as aforce sensor or a gyro sensor or a signal line for transmitting signalsto the devices is included in the wrist joints 2020 or the robot hand2000, and an extremely large number of wirings is necessary.Accordingly, it was extremely difficult to dispose wirings in the joints2020 or the robot hand 2000. However, since the piezoelectric drivingdevice 10 of the embodiment described above can decrease a drivingcurrent, compared to a general electric motor or a piezoelectric drivingdevice of the related art, it is possible to dispose wirings even in asmall space such as the joint 2020 (particularly, a joint on the edge ofthe arm 2010) or the robot hand 2000.

FIG. 18 is an explanatory diagram showing an example of a liquid feedingpump 2200 using the piezoelectric driving device 10 described above. Theliquid feeding pump 2200 includes a reservoir 2211, a tube 2212, thepiezoelectric driving device 10, a rotor 2222, a decelerationtransmission mechanism 2223, a cam 2202, and a plurality of fingers2213, 2214, 2215, 2216, 2217, 2218, and 2219 in case 2230. The reservoir2211 is an accommodation portion which accommodates liquid which is atransportation target. The tube 2212 is a tube which transports theliquid sent from the reservoir 2211. A protrusion 20 of thepiezoelectric driving device 10 is provided in a state of being pressedagainst a side surface of the rotor 2222 and the piezoelectric drivingdevice 10 rotates the rotor 2222. A rotation force of the rotor 2222 istransmitted to the cam 2202 through the deceleration transmissionmechanism 2223. The fingers 2213 to 2219 are members which block thetube 2212. When the cam 2202 is rotated, the fingers 2213 to 2219 arepressed to the outer side in an emission direction in order, by aprotrusion 2202A of the cam 2202. The fingers 2213 to 2219 block thetube 2212 in order from the upstream side in a transportation direction(reservoir 2211 side). Accordingly, the liquid in the tube 2212 istransmitted to the downstream side in order. By doing so, it is possibleto accurately feed an extremely small amount of liquid and to implementa small liquid feeding pump 2200. The disposition of each member is notlimited to that shown in the drawing. The members such as fingers or thelike may not be provided and a ball or the like provided on the rotor2222 may block the tube 2212. The liquid feeding pump 2200 describedabove can be used as a dosing apparatus which gives medication such asinsulin to a human body. Herein, by using the piezoelectric drivingdevice 10 of the embodiment described above, a driving current isdecreased, compared to a case of the piezoelectric driving device of therelated art, and accordingly, it is possible to decrease powerconsumption of the dosing apparatus. Accordingly, when the dosingapparatus is driven with a battery, the effects are particularlyeffective.

Modification Examples

The invention is not limited to the examples or embodiments describedabove and can be implemented in various forms within a range notdeparting from a gist thereof, and the following modifications can alsobe performed, for example.

Modification Example 1

In the embodiment, one piezoelectric vibrating body 100 is provided onboth surfaces of the vibrating plate 200, but one of the piezoelectricvibrating bodies 100 can be omitted. However, it is preferable toprovide the piezoelectric vibrating body 100 on both surfaces of thevibrating plate 200, because the vibrating plate 200 can be deformed ina meander shape to be curved in the plane thereof.

Modification Example 2

The sectional structure or the wiring connection structure described inthe embodiment is merely an example and other sectional structures orwiring connection structures can be used. For example, regarding thekinds of the layer or the number of layers in the wiring connectionstructure, an arbitrary kind or number of the layers other than that ofthe embodiment described above can be suitably used. In the wiringpattern formed on the vibrating plate 200, it is not necessary to formboth of the first wiring which is electrically connected to the firstelectrode 130 of the piezoelectric element 110 and the second wiringwhich is electrically connected to the second electrode 150, and onlythe wiring which is electrically connected to one of the first electrode130 and the second electrode 150 may be formed. In this case, the otherone of the first electrode 130 and the second electrode 150 can beconnected to the driving circuit through an arbitraryelectrically-connected wiring other than the wiring pattern formed onthe vibrating plate 200.

Hereinabove, the embodiments of the invention have been described basedon some examples, but the embodiments of the invention are for easyunderstanding of the invention and not for limiting the invention. Theinvention can include modifications, improvement, and equivalents to theinvention, without departing from a gist and a scope of the aspects.

The entire disclosure of Japanese Patent Application No. 2014-164631,filed Aug. 13, 2014 is expressly incorporated by reference herein.

What is claimed is:
 1. A piezoelectric driving device comprising: avibrating plate; and a piezoelectric vibrating body including asubstrate, a piezoelectric body which is provided between the substrateand the vibrating plate, a first electrode which is provided between thepiezoelectric body and the substrate, and a second electrode which isprovided between the piezoelectric body and the vibrating plate, whereina wiring pattern electrically connected to at least one of the firstelectrode and the second electrode is formed on the vibrating plate. 2.The piezoelectric driving device according to claim 1, wherein thewiring pattern includes a first wiring which is electrically connectedto the first electrode and a second wiring which is electricallyconnected to the second electrode.
 3. The piezoelectric driving deviceaccording to claim 2, wherein the first electrode and the first wiringare electrically connected to each other through a first laminatedconducting portion, and the second electrode and the second wiring areelectrically connected to each other through a second laminatedconducting portion.
 4. The piezoelectric driving device according toclaim 3, further comprising: a conducting pattern of at least one layerwhich is provided between the first electrode and the wiring pattern,wherein the first laminated conducting portion and the second laminatedconducting portion are formed on the conducting pattern of each layer.5. The piezoelectric driving device according to claim 4, wherein theconducting pattern at a position farthest from the substrate in alamination direction among the conducting patterns of at least onelayer, is electrically connected to the wiring pattern of the vibratingplate so that the surfaces come in contact with each other.
 6. Thepiezoelectric driving device according to claim 4, wherein an insulatinglayer is provided between the conducting pattern at a position closestto the second electrode in a lamination direction among the conductingpattern of at least one layer, and the second electrode, and theconducting pattern at a position closest to the second electrode and thesecond electrode are electrically connected to each other through aplurality of contact holes provided on the insulating layer.
 7. Thepiezoelectric driving device according to claim 4, wherein theconducting pattern of at least one layer includes a first conductingpattern, a second conducting pattern, and an insulating layer which isprovided between the first conducting pattern and the second conductingpattern, the first laminated conducting portion in the first conductingpattern and the first laminated conducting portion in the secondconducting pattern are electrically connected to each other through aplurality of contact holes provided on the insulating layer, and thesecond laminated conducting portion in the first conducting pattern andthe second laminated conducting portion in the second conducting patternare electrically connected to each other through a plurality of contactholes provided on the insulating layer.
 8. The piezoelectric drivingdevice according to claim 1, wherein the vibrating plate includes asurface portion on which the piezoelectric vibrating body is not loaded,and the wiring pattern is formed to be extended to a surface portion onwhich the piezoelectric vibrating body is not loaded.
 9. Thepiezoelectric driving device according to claim 1, wherein thepiezoelectric body has a thickness of 0.05 μm to 20 μm.
 10. Thepiezoelectric driving device according to claim 1, wherein the vibratingplate is formed with a conductive member, and a part of the wiringpattern is formed over the side surface of the vibrating plate and iselectrically connected to the vibrating plate.
 11. The piezoelectricdriving device according to claim 1, wherein the piezoelectric vibratingbody includes a plurality of piezoelectric elements configured with thefirst electrode, the piezoelectric body, and the second electrode, theplurality of piezoelectric elements are divided into N sets (N is aninteger equal to or larger than 2) of piezoelectric element groups, whenone or more piezoelectric elements driven at the same time are set asone set of a piezoelectric element group, the second electrodes of twoor more piezoelectric elements are directly connected to each otherthrough a connection wiring, when each set of the piezoelectric elementgroup includes two or more piezoelectric elements, and N second wiringsand N second laminated conducting portions are provided to be insulatedfrom each other, and to correspond to each second electrode of the Nsets of piezoelectric element groups.
 12. The piezoelectric drivingdevice according to claim 1, further comprising: a protrusion which isprovided on the vibrating plate and comes in contact with a body to bedriven.
 13. A robot comprising: a plurality of linking portions; jointsconnected to the plurality of linking portions; and the piezoelectricdriving device according to claim 1 which rotates the plurality oflinking portions using the joints.
 14. A robot comprising: a pluralityof linking portions; joints connected to the plurality of linkingportions; and the piezoelectric driving device according to claim 2which rotates the plurality of linking portions using the joints.
 15. Arobot comprising: a plurality of linking portions; joints connected tothe plurality of linking portions; and the piezoelectric driving deviceaccording to claim 3 which rotates the plurality of linking portionsusing the joints.
 16. A robot comprising: a plurality of linkingportions; joints connected to the plurality of linking portions; and thepiezoelectric driving device according to claim 4 which rotates theplurality of linking portions using the joints.
 17. A driving method ofthe robot according to claim 13, wherein a driving circuit of thepiezoelectric driving device applies an AC voltage or a voltage obtainedby applying an offset voltage to the AC voltage as a driving voltagebetween the first electrode and the second electrode, to rotate theplurality of linking portions using the joints.
 18. A driving method ofthe piezoelectric driving device according to claim 1, comprising:applying an AC voltage or a voltage obtained by applying an offsetvoltage to the AC voltage as a driving voltage between the firstelectrode and the second electrode.
 19. A driving method of thepiezoelectric driving device according to claim 2, comprising: applyingan AC voltage or a voltage obtained by applying an offset voltage to theAC voltage as a driving voltage between the first electrode and thesecond electrode.
 20. A driving method of the piezoelectric drivingdevice according to claim 3, comprising: applying an AC voltage or avoltage obtained by applying an offset voltage to the AC voltage as adriving voltage between the first electrode and the second electrode.